GENEVA, Dec. 9 -- DENSO CORPORATION (1-1, Showa-cho, Kariya-city, Aichi4488661), 株式会社デンソー (愛知県刈谷市昭和町１丁目１番地) filed a patent application (PCT/JP2025/019531) for "METHOD FOR PRODUCING SILICON CARBIDE WAFER" on May 29, 2025. With publication no. WO/2025/249524, the details related to the patent application was published on Dec 04, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): UEHARA, Junichi (c/o DENSO CORPORATION 1-1, Showa-cho, Kariy...