INTERNATIONAL PATENT: DENSO CORPORATION, 株式会社デンソー FILES APPLICATION FOR "ANALYSIS DEVICE, ANALYSIS PROGRAM, METHOD, SEMICONDUCTOR DEVICE AND SEMICONDUCTOR WAFER"

GENEVA, July 2 -- DENSO CORPORATION (1-1, Showa-cho, Kariya-city Aichi4488661), 株式会社デンソー (愛知県刈谷市昭和町１丁目１番地) filed a patent application (PCT/JP2024/024520) for "ANALYSIS DEVICE, ANALYSIS PROGRAM, METHOD, SEMICONDUCTOR DEVICE, AND SEMICONDUCTOR WAFER" on Jul 08, 2024. With publication no. WO/2025/134410, the details related to the patent application was published on Jun 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SUGO Hidetake (...