GENEVA, Oct. 27 -- DENKA COMPANY LIMITED (1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo1038338), デンカ株式会社 (東京都中央区日本橋室町二丁目1番1号) filed a patent application (PCT/JP2025/014183) for "SEALING MATERIAL FOR PHOTOELECTRIC CONVERSION ELEMENT, DAM MATERIAL, FILL MATERIAL, METHOD FOR PRODUCING DEVICE USING DAM MATERIAL, AND METHOD FOR PRODUCING DEVICE USING FILL MATERIAL" on Apr 09, 2025. With publication no. WO/2025/220565, the details related to the patent application was published on Oct 23, 2025.
Notably, the patent application was submitted under the International Patent...