INTERNATIONAL PATENT: DENKA COMPANY LIMITED, デンカ株式会社 FILES APPLICATION FOR "RESIN COMPOSITION AND LAMINATED MOLDED ARTICLE"

GENEVA, July 9 -- DENKA COMPANY LIMITED (1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo1038338), デンカ株式会社 (東京都中央区日本橋室町二丁目１番１号) filed a patent application (PCT/JP2024/046323) for "RESIN COMPOSITION AND LAMINATED MOLDED ARTICLE" on Dec 27, 2024. With publication no. WO/2025/143188, the details related to the patent application was published on Jul 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KIMURA, Akiyoshi (c/o...