INTERNATIONAL PATENT: DENKA COMPANY LIMITED, デンカ株式会社 FILES APPLICATION FOR "QUICK SETTING MATERIAL FOR CEMENTLESS MATERIAL, SPRAYING MATERIAL AND SPRAYING METHOD"

GENEVA, Oct. 5 -- DENKA COMPANY LIMITED (1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo1038338), デンカ株式会社 (東京都中央区日本橋室町二丁目１番１号) filed a patent application (PCT/JP2025/009830) for "QUICK SETTING MATERIAL FOR CEMENTLESS MATERIAL, SPRAYING MATERIAL, AND SPRAYING METHOD" on Mar 14, 2025. With publication no. WO/2025/205050, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WI...