INTERNATIONAL PATENT: DENKA COMPANY LIMITED, デンカ株式会社 FILES APPLICATION FOR "FILM FOR WAFER PROCESSING AND WAFER PROCESSING METHOD"

GENEVA, Sept. 17 -- DENKA COMPANY LIMITED (1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo1038338), デンカ株式会社 (東京都中央区日本橋室町二丁目１番１号) filed a patent application (PCT/JP2025/007505) for "FILM FOR WAFER PROCESSING AND WAFER PROCESSING METHOD" on Mar 03, 2025. With publication no. WO/2025/187637, the details related to the patent application was published on Sep 11, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KAWAGUCHI Ao...