GENEVA, Sept. 2 -- DENKA COMPANY LIMITED (1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo1038338), デンカ株式会社 (東京都中央区日本橋室町二丁目１番１号) filed a patent application (PCT/JP2025/003518) for "DICING TAPE AND WAFER PROCESSING METHOD" on Feb 04, 2025. With publication no. WO/2025/177820, the details related to the patent application was published on Aug 28, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KUDO Keita (c/o Denka Compa...