INTERNATIONAL PATENT: DENKA COMPANY LIMITED, デンカ株式会社 FILES APPLICATION FOR "COVER TAPE AND ELECTRONIC COMPONENT PACKAGE COMPRISING SAME"

GENEVA, May 5 -- DENKA COMPANY LIMITED (1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo1038338), デンカ株式会社 (東京都中央区日本橋室町二丁目１番１号) filed a patent application (PCT/JP2024/038037) for "COVER TAPE AND ELECTRONIC COMPONENT PACKAGE COMPRISING SAME" on Oct 25, 2024. With publication no. WO/2025/089367, the details related to the patent application was published on May 01, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KITAYAMA,...