GENEVA, Aug. 18 -- DENKA COMPANY LIMITED (1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo1038338), デンカ株式会社 (東京都中央区日本橋室町二丁目１番１号) filed a patent application (PCT/JP2025/001380) for "CIRCUIT BOARD, METHOD FOR MANUFACTURING SAME, CIRCUIT BOARD GROUP, AND POWER MODULE" on Jan 17, 2025. With publication no. WO/2025/169687, the details related to the patent application was published on Aug 14, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO...