GENEVA, Oct. 5 -- DENKA COMPANY LIMITED (1-1, Nihonbashi-Muromachi 2-chome, Chuo-ku, Tokyo1038338), デンカ株式会社 (東京都中央区日本橋室町二丁目１番１号) filed a patent application (PCT/JP2025/010312) for "CHLOROPRENE-BASED POLYMER LATEX, ADHESIVE AGENT COMPOSITION, COMPOSITION FOR FORMING DIP-MOLDED ARTICLE, DIP-MOLDED ARTICLE, AND METHOD FOR PRODUCING CHLOROPRENE-BASED POLYMER LATEX" on Mar 17, 2025. With publication no. WO/2025/205199, the details related to the patent application was published on Oct 02, 2025.
Notably, the patent application was submitted under the International Patent Cl...