INTERNATIONAL PATENT: DEMAX HOLOGRAMS PLC. FILES APPLICATION FOR "EMBOSSED SUBSTRATE FOR USE AS DOVID AND METHOD OF ITS MANUFACTURE"

GENEVA, March 9 -- DEMAX HOLOGRAMS PLC. (16, Abagar str., distr. Gorublyane,1138 Sofia) filed a patent application (PCT/EP2024/073638) for "EMBOSSED SUBSTRATE FOR USE AS DOVID AND METHOD OF ITS MANUFACTURE" on Aug 23, 2024. With publication no. WO/2025/045748, the details related to the patent application was published on Mar 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MONOVSKI, Valentin Konstantinov (Mladost 2 distrct, bl. 202, entr. 1, ap. 181799 Sofia)

Abstract: The present invention relates to a thermoplastic polymeric substrate bearing on part of at least one of its surfaces ...