INTERNATIONAL PATENT: DECA TECHNOLOGIES USA, INC. FILES APPLICATION FOR "MOLDED BRIDGE WITH VERTICAL INTERCONNECTS AND METHOD OF MAKING THE SAME"

GENEVA, Dec. 24 -- DECA TECHNOLOGIES USA, INC. (7855 South River Parkway, Ste. 205Tempe, Arizona 85284) filed a patent application (PCT/US2025/032127) for "MOLDED BRIDGE WITH VERTICAL INTERCONNECTS AND METHOD OF MAKING THE SAME" on Jun 03, 2025. With publication no. WO/2025/259478, the details related to the patent application was published on Dec 18, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BISHOP, Craig (8398 E Verde Ln.Scottsdale, Arizona 85251), HOFFMAN, Paul R. (10261 Kaiser PlSan Diego, California 92126)

Abstract: An electronic assembly with a molded bridge, vertical interconne...