INTERNATIONAL PATENT: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC FILES APPLICATION FOR "WATER BASED RUBBER TO METAL BONDING AGENT WITH IMPROVED PREBAKE RESISTANCE"

GENEVA, Nov. 25 -- DDP SPECIALTY ELECTRONIC MATERIALS US, LLC (974 Centre RoadWilmington, Delaware 19805) filed a patent application (PCT/US2025/026502) for "WATER BASED RUBBER TO METAL BONDING AGENT WITH IMPROVED PREBAKE RESISTANCE" on Apr 25, 2025. With publication no. WO/2025/240103, the details related to the patent application was published on Nov 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): DEHNICKE, Stefan (Alsbacherstrasse 2 B64342 Seeheim-Jugenheim), ZUTAVERN, Philipp (Am Wasserpark 2560389 Frankfurt am Main), ZIEGLER, Kai (Industriepark Hochst, Building G83065929 Frankfurt),...