INTERNATIONAL PATENT: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC FILES APPLICATION FOR "UNDERGROUND WALL, ITS CONSTRUCTION METHOD AND FORMWORK PANELS USED THEREIN"

GENEVA, Jan. 28 -- DDP SPECIALTY ELECTRONIC MATERIALS US, LLC (974 Centre Road, Bldg. 730Wilmington, Delaware 19805) filed a patent application (PCT/US2024/037527) for "UNDERGROUND WALL, ITS CONSTRUCTION METHOD, AND FORMWORK PANELS USED THEREIN" on Jul 11, 2024. With publication no. WO/2025/019253, the details related to the patent application was published on Jan 23, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): NISHIMOTO, Daisaku (2-11-1, Nagata-Cho, Chiyoda-kuTokyo, Tokyo)

Abstract: To provide an underground wall having an embedded retaining wall, that can be constructed more inexpen...