INTERNATIONAL PATENT: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC FILES APPLICATION FOR "TWO-COMPONENT THERMALLY CONDUCTIVE ADHESIVE WITH IMPROVED LATENCY"

GENEVA, Feb. 4 -- DDP SPECIALTY ELECTRONIC MATERIALS US, LLC (974 Centre RoadWilmington, Delaware 19805) filed a patent application (PCT/US2024/037512) for "TWO-COMPONENT THERMALLY CONDUCTIVE ADHESIVE WITH IMPROVED LATENCY" on Jul 11, 2024. With publication no. WO/2025/024140, the details related to the patent application was published on Jan 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): GRUNDER, Sergio (Wolleraustrasse 15a8807 Freienbach), KUNZ, Joel (Wolleraustrasse 15a8807 Freienbach), SCHMATLOCH, Stefan (Wolleraustrasse 15a8807 Freienbach)

Abstract: Two-component thermally condu...