GENEVA, June 18 -- DDP SPECIALTY ELECTRONIC MATERIALS US, LLC (974 Centre RoadWilmington, Delaware 19805) filed a patent application (PCT/US2024/054832) for "THERMAL INTERFACE MATERIAL WITH MINIMUM USE OF EPOXY RESINS" on Nov 07, 2024. With publication no. WO/2025/122286, the details related to the patent application was published on Jun 12, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): GRUNDER, Sergio (Wolleraustrasse 15a8807 Freienbach), KUSTER, Michelle (Wolleraustrasse 15a8807 Freienbach), UZUNSKA, Maria (Wolleraustrasse 15a8807 Freienbach), SCHMATLOCH, Stefan (Wolleraustrasse 15a8807 ...