INTERNATIONAL PATENT: DDP SPECIALTY ELECTRONIC MATERIALS US, LLC, ROHM AND HAAS ELECTRONIC MATERIALS (SHANGHAI) LTD. FILES APPLICATION FOR "TWO-COMPONENT THERMALLY CONDUCTIVE ADHESIVE FORMULATION WITH IMPROVED VISCOSITY STABILITY"

GENEVA, Feb. 2 -- DDP SPECIALTY ELECTRONIC MATERIALS US, LLC (974 Centre Road, Bldg 730, WilmingtonDelaware 19805), ROHM AND HAAS ELECTRONIC MATERIALS (SHANGHAI) LTD. (No. 600, Cailun Road, Zhangjiang Hi-Tech ParkPudong New Area, Shanghai 201203) filed a patent application (PCT/CN2023/109544) for "TWO-COMPONENT THERMALLY CONDUCTIVE ADHESIVE FORMULATION WITH IMPROVED VISCOSITY STABILITY" on Jul 27, 2023. With publication no. WO/2025/020168, the details related to the patent application was published on Jan 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CLARK, Thomas (1250 Harmon Road Aub...