INTERNATIONAL PATENT: DAIHEN CORPORATION, 株式会社ダイヘン, THE UNIVERSITY OF OSAKA, 国立大学法人大阪大学 FILES APPLICATION FOR "RESISTANCE SPOT JOINING DEVICE AND RESISTANCE SPOT JOINING METHOD"

Posted On: 2026-02-03

GENEVA, Feb. 3 -- DAIHEN CORPORATION (1-11, Tagawa 2-chome, Yodogawa-ku, Osaka-shi, Osaka5328512), 株式会社ダイヘン (大阪府大阪市淀川区田川２丁目１番１１号), THE UNIVERSITY OF OSAKA (1-1, Yamadaoka, Suita-shi, Osaka5650871), 国立大学法人大阪大学 (大阪府吹田市山田丘１番１号) filed a patent application (PCT/JP2025/024493) for "RESISTANCE SPOT JOINING DEVICE AND RESISTANCE SPOT JOINING METHOD" on Jul 08, 2025. With publication no. WO/2026/023404, th...

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INTERNATIONAL PATENT: DAIHEN CORPORATION, 株式会社ダイヘン, THE UNIVERSITY OF OSAKA, 国立大学法人大阪大学 FILES APPLICATION FOR "RESISTANCE SPOT JOINING DEVICE AND RESISTANCE SPOT JOINING METHOD"