INTERNATIONAL PATENT: DAI NIPPON PRINTING CO., LTD., 大日本印刷株式会社 FILES APPLICATION FOR "THROUGH-ELECTRODE SUBSTRATE INTERMEDIATE, THROUGH-ELECTRODE SUBSTRATE, THROUGH-ELECTRODE SUBSTRATE WITH ELEMENT AND SEMICONDUCTOR DEVICE"

GENEVA, May 19 -- DAI NIPPON PRINTING CO., LTD. (1-1, Ichigaya-kagacho 1-chome, Shinjuku-ku, Tokyo1628001), 大日本印刷株式会社 (東京都新宿区市谷加賀町一丁目１番１号) filed a patent application (PCT/JP2024/040007) for "THROUGH-ELECTRODE SUBSTRATE INTERMEDIATE, THROUGH-ELECTRODE SUBSTRATE, THROUGH-ELECTRODE SUBSTRATE WITH ELEMENT, AND SEMICONDUCTOR DEVICE" on Nov 11, 2024. With publication no. WO/2025/100547, the details related to the patent application was published on May 15, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) s...