INTERNATIONAL PATENT: DAI NIPPON PRINTING CO., LTD., 大日本印刷株式会社 FILES APPLICATION FOR "THROUGH-ELECTRODE SUBSTRATE AND METHOD FOR MANUFACTURING THROUGH-ELECTRODE SUBSTRATE"

GENEVA, June 17 -- DAI NIPPON PRINTING CO., LTD. (1-1, Ichigaya-kaga-cho 1-chome, Shinjuku-ku, Tokyo1628001), 大日本印刷株式会社 (東京都新宿区市谷加賀町一丁目１番１号) filed a patent application (PCT/JP2024/043050) for "THROUGH-ELECTRODE SUBSTRATE AND METHOD FOR MANUFACTURING THROUGH-ELECTRODE SUBSTRATE" on Dec 05, 2024. With publication no. WO/2025/121374, the details related to the patent application was published on Jun 12, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual P...