GENEVA, March 10 -- DAI NIPPON PRINTING CO., LTD. (1-1, Ichigaya-kaga-cho 1-chome, Shinjuku-ku, Tokyo1628001), 大日本印刷株式会社 (東京都新宿区市谷加賀町一丁目１番１号) filed a patent application (PCT/JP2024/031400) for "THROUGH-ELECTRODE SUBSTRATE AND METHOD FOR MANUFACTURING THROUGH-ELECTRODE SUBSTRATE" on Aug 30, 2024. With publication no. WO/2025/047976, the details related to the patent application was published on Mar 06, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual ...