INTERNATIONAL PATENT: DAI NIPPON PRINTING CO., LTD., 大日本印刷株式会社 FILES APPLICATION FOR "THROUGH ELECTRODE SUBSTRATE, THROUGH ELECTRODE SUBSTRATE WITH ELEMENT, SEMICONDUCTOR DEVICE AND SUBSTRATE FOR THROUGH ELECTRODE"

GENEVA, Jan. 13 -- DAI NIPPON PRINTING CO., LTD. (1-1, Ichigaya-kagacho 1-chome, Shinjuku-ku, Tokyo1628001), 大日本印刷株式会社 (東京都新宿区市谷加賀町一丁目１番１号) filed a patent application (PCT/JP2025/023972) for "THROUGH ELECTRODE SUBSTRATE, THROUGH ELECTRODE SUBSTRATE WITH ELEMENT, SEMICONDUCTOR DEVICE, AND SUBSTRATE FOR THROUGH ELECTRODE" on Jul 03, 2025. With publication no. WO/2026/009953, the details related to the patent application was published on Jan 08, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, w...