INTERNATIONAL PATENT: DAI NIPPON PRINTING CO., LTD., 大日本印刷株式会社 FILES APPLICATION FOR "THROUGH ELECTRODE SUBSTRATE, SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF"

GENEVA, April 20 -- DAI NIPPON PRINTING CO., LTD. (1-1, Ichigaya-kaga-cho 1-chome, Shinjuku-ku, Tokyo1628001), 大日本印刷株式会社 (東京都新宿区市谷加賀町一丁目１番１号) filed a patent application (PCT/JP2024/036453) for "THROUGH ELECTRODE SUBSTRATE, SEMICONDUCTOR PACKAGE, AND MANUFACTURING METHOD THEREOF" on Oct 11, 2024. With publication no. WO/2025/079686, the details related to the patent application was published on Apr 17, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual ...