GENEVA, Nov. 25 -- CYTEC INDUSTRIES INC. (2564 US Highway 1Lawrence, NJ 08648) filed a patent application (PCT/US2025/029384) for "ADHESIVE FOR HIGH-PERFORMANCE BONDING" on May 14, 2025. With publication no. WO/2025/240633, the details related to the patent application was published on Nov 20, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): SANG, Junjie, Jeffrey (1300 Revolution StreetHarve De Grace, MD), KOHLI, Dalip, K. (2909 Meadow View WayChurchville, MD 21028)
Abstract: An adhesive composition containing: (a) a pre-react formed by reacting a mixture comprising (i) one or more epoxy res...