GENEVA, May 14 -- CUPRUM MATERIALS CORP. (Center for Technical Assistance to Small and Medium Industries, Room number 31576, Hanggongdaehak-ro, Deogyang-guGoyang-si,Gyeonggi-do 10540), 주식회사 큐프럼 머티리얼즈 (경기도고양시덕양구 항공대학로 76, 중소벤처육성지원센터 315호) filed a patent application (PCT/KR2024/017064) for "ALLOY COMPOSITION, TIECOAT LAYER FORMED FROM ALLOY COMPOSITION, WIRING LAYER, AND FLEXIBLE CIRCUIT BOARD INCLUDING SAME WIRING LAYER" on Nov 01, 2024. With publication no. WO/2025/095690, the details r...