INTERNATIONAL PATENT: CSP TECHNOLOGIES, INC. FILES APPLICATION FOR "RECYCLABLE BLISTER PACK WITH MULTILAYER COMPONENT AND METHOD OF RECYCLING SAME"

GENEVA, April 8 -- CSP TECHNOLOGIES, INC. (960 West Veterans BoulevardAuburn, Alabama 36832) filed a patent application (PCT/US2024/048653) for "RECYCLABLE BLISTER PACK WITH MULTILAYER COMPONENT, AND METHOD OF RECYCLING SAME" on Sep 26, 2024. With publication no. WO/2025/072515, the details related to the patent application was published on Apr 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HOLLINGER, James S. (c/o CSP Technologies, Inc.960 West Veterans BoulevardAuburn, Alabama 36832)

Abstract: A recyclable blister pack (110) configured to sealingly enclose at least one multilayer c...