INTERNATIONAL PATENT: CREELED, INC. FILES APPLICATION FOR "ENCAPSULATION STRUCTURES FOR LIGHT-EMITTING DIODE PACKAGES"

GENEVA, Oct. 25 -- CREELED, INC. (4001 E Hwy 54 Suite 2000 DurhamNorth Carolina 27709) filed a patent application (PCT/CN2024/088372) for "ENCAPSULATION STRUCTURES FOR LIGHT-EMITTING DIODE PACKAGES" on Apr 17, 2024. With publication no. WO/2025/217840, the details related to the patent application was published on Oct 23, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ZHANG, Miao (Room 2402#, Block 3#, City Park 2nd CommunityHuizhou, Guangdong 516000), ZHANG, Jin (Room 303#, Block 4B#, ShiHu CourtHuizhou, Guangdong 516000), FEI, Xiang (Room 311C#, Block 510#, DongHu Garden Zone No.5Huizhou,...