GENEVA, March 10 -- COUPANG CORP. (18F, 570 Songpa-daero,Songpa-gu,Seoul 05510), 쿠팡 주식회사 (서울특별시송파구송파대로 570, 18층) filed a patent application (PCT/KR2023/018823) for "ELECTRONIC APPARATUS FOR PROVIDING BUNDLE PRODUCT INFORMATION AND METHOD THEREFOR" on Nov 21, 2023. With publication no. WO/2025/048056, the details related to the patent application was published on Mar 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YANG, Sun Kyung (570 Songpa-daero,Songpa-gu,...