INTERNATIONAL PATENT: CORNING RESEARCH & DEVELOPMENT CORPORATION FILES APPLICATION FOR "DEVICES, SYSTEMS AND METHODS FOR HIGH DENSITY FIBER CONNECTIVITY"

GENEVA, Nov. 11 -- CORNING RESEARCH & DEVELOPMENT CORPORATION (One Riverfront PlazaCorning, New York 14831) filed a patent application (PCT/US2025/026729) for "DEVICES, SYSTEMS, AND METHODS FOR HIGH DENSITY FIBER CONNECTIVITY" on Apr 29, 2025. With publication no. WO/2025/230929, the details related to the patent application was published on Nov 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BOSKOVIC, Aleksandra (7 Woodview DriveElmira, New York 14903), SPREEMANN, Martin (Arnold Zweig Str. 3713189 Berlin), TEN HAVE, Eric Stephan (Pettenkoferstrasse 810247 Berlin)

Abstract: Systems that...