INTERNATIONAL PATENT: CORNING INCORPORATED FILES APPLICATION FOR "SUBSTRATE WITH HIGH POROSITY AND LOW BULK DENSITY"

GENEVA, March 10 -- CORNING INCORPORATED (1 Riverfront PlazaCorning, New York 14831) filed a patent application (PCT/US2024/043968) for "SUBSTRATE WITH HIGH POROSITY AND LOW BULK DENSITY" on Aug 27, 2024. With publication no. WO/2025/049430, the details related to the patent application was published on Mar 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHEN, Guohua (3507 Conhocton RoadPainted Post, New York 14870)

Abstract: A substrate includes an inorganic matrix including an interconnected pore structure. A total pore volume of the matrix as determined by mercury porosimetry is gr...