INTERNATIONAL PATENT: CORNING INCORPORATED FILES APPLICATION FOR "METHODS OF MAKING AN ELECTRICALLY CONDUCTIVE ALUMINUM - CONTAINING SUBSTRATE"

GENEVA, June 12 -- CORNING INCORPORATED (One Riverfront PlazaCorning, New York 14831) filed a patent application (PCT/US2024/056873) for "METHODS OF MAKING AN ELECTRICALLY CONDUCTIVE ALUMINUM - CONTAINING SUBSTRATE" on Nov 21, 2024. With publication no. WO/2025/117324, the details related to the patent application was published on Jun 05, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHEN, Guohua (3507 Conhocton RoadPainted Post, New York 14870)

Abstract: A method of forming an electrically conductive substrate. The method includes heating a green body by exposing the green body to a he...