INTERNATIONAL PATENT: CORNING INCORPORATED FILES APPLICATION FOR "METHODS FOR PROCESSING SILICA-CONTAINING SUBSTRATE FOR FILLING VIAS WITH METAL"

GENEVA, May 28 -- CORNING INCORPORATED (1 Riverfront PlazaCorning, New York 14831) filed a patent application (PCT/US2024/051715) for "METHODS FOR PROCESSING SILICA-CONTAINING SUBSTRATE FOR FILLING VIAS WITH METAL" on Oct 17, 2024. With publication no. WO/2025/106211, the details related to the patent application was published on May 22, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LEE, Jaewon (112-3001, Yedang woomi lynn Apartement, 277Hwaseong-siGyeonggi-do 18447), MOON, Byungdoo (Cheoncheon-dong, Cheoncheonprugio 104dong 1001hoSuwon-siGyeonggi-do 16420), PARK, Kwangchul (33, Buksu-ro, ...