INTERNATIONAL PATENT: CORNING INCORPORATED FILES APPLICATION FOR "CERAMIC-BASED SUBSTRATE AND METHODS OF CUTTING THE SAME"

GENEVA, Sept. 17 -- CORNING INCORPORATED (One Riverfront PlazaCorning, New York 14831) filed a patent application (PCT/US2025/018099) for "CERAMIC-BASED SUBSTRATE AND METHODS OF CUTTING THE SAME" on Mar 03, 2025. With publication no. WO/2025/188603, the details related to the patent application was published on Sep 11, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LI, Xinghua (14 Ambrose DriveHorseheads, New York 14845)

Abstract: Methods of cutting a ceramic-based substrate that is polycrystalline with a thickness from 10 micrometers to 200 micrometers includes emitting a laser beam tha...