INTERNATIONAL PATENT: CORNING INCORPORATED FILES APPLICATION FOR "APPARATUS AND PROCESS FOR TEMPERATURE SWING ADSORPTION WITH RESISTIVE HEATING"

GENEVA, March 18 -- CORNING INCORPORATED (1 Riverfront PlazaCorning, New York 14831) filed a patent application (PCT/US2024/043969) for "APPARATUS AND PROCESS FOR TEMPERATURE SWING ADSORPTION WITH RESISTIVE HEATING" on Aug 27, 2024. With publication no. WO/2025/054041, the details related to the patent application was published on Mar 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BOGER, Thorsten Rolf (Johann-Pipberger-Strasse 6D-65520 Bad Camberg), KUNATH, Florian (Tannenring 7765207 Wiesbaden, Hessen)

Abstract: Apparatuses and methods of removing or separating CO2 from a process ga...