INTERNATIONAL PATENT: CORNING INCORPORATED FILES APPLICATION FOR "A METHOD FOR METALLIZATION THROUGH-GLASS VIAS AND A GLASS ARTICLE MANUFACUTURED THEREOF"

GENEVA, Dec. 10 -- CORNING INCORPORATED (One Riverfront PlazaCorning, New York 14831) filed a patent application (PCT/US2025/029320) for "A METHOD FOR METALLIZATION THROUGH-GLASS VIAS AND A GLASS ARTICLE MANUFACUTURED THEREOF" on May 14, 2025. With publication no. WO/2025/250361, the details related to the patent application was published on Dec 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): SUBBAIYAN, Navaneetha Krishnan (6556 SW Lupine LnWilsonville, Oregon 97070)

Abstract: A method for metallizing through-glass vias in a glass substrate includes: a) cleaning a glass substrate compri...