INTERNATIONAL PATENT: COLOPLAST A/S FILES APPLICATION FOR "OSTOMY APPLIANCE WITH CONDUCTIVE SILICONE COMPOUND"

GENEVA, April 6 -- COLOPLAST A/S (Holtedam 13050 Humlebaek) filed a patent application (PCT/DK2024/050224) for "OSTOMY APPLIANCE WITH CONDUCTIVE SILICONE COMPOUND" on Sep 26, 2024. With publication no. WO/2025/067617, the details related to the patent application was published on Apr 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): DAPRA, Johannes (Parkvej 18DK-3450 Alleroed)

Abstract: An ostomy appliance comprising a first adhesive with a first proximal surface for attachment of the ostomy appliance to the skin of a user; a second compound with a second proximal surface configured to ...