INTERNATIONAL PATENT: CISCO TECHNOLOGY, INC. FILES APPLICATION FOR "VIA ASSEMBLY FOR PRINTED CIRCUIT BOARD"

GENEVA, Sept. 10 -- CISCO TECHNOLOGY, INC. (170 West Tasman DriveSan Jose, CA 95134-1706) filed a patent application (PCT/US2025/016990) for "VIA ASSEMBLY FOR PRINTED CIRCUIT BOARD" on Feb 24, 2025. With publication no. WO/2025/184015, the details related to the patent application was published on Sep 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): GAO, Mingjian (No. 1188, Tangshan RoadShanghai), ZUO, Mingtong (3rd floor of XinSi building, No.926 Yishan RoadCaohejing Hi-Tech Park, Shanghai), MA, Wenbin (Room 1603, Building 25, Banting Road 855Songjiang District, Shanghai, 201615), SAPOZH...