INTERNATIONAL PATENT: CISCO TECHNOLOGY, INC. FILES APPLICATION FOR "LIQUID COOLING USING PCB THROUGH HOLES"

GENEVA, July 30 -- CISCO TECHNOLOGY, INC. (170 W. Tasman DriveSan Jose, California 95134) filed a patent application (PCT/US2025/011268) for "LIQUID COOLING USING PCB THROUGH HOLES" on Jan 10, 2025. With publication no. WO/2025/155487, the details related to the patent application was published on Jul 24, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HU, Jordan K. (c/o Cisco Technology, Inc.170 W. Tasman DriveSan Jose, California 95134), RAMESH, Tushara (c/o Cisco Technology, Inc.170 W. Tasman DriveSan Jose, California 95134), DEPANI, Bhumil (c/o Cisco Technology, Inc.170 W. Tasman DriveSa...