INTERNATIONAL PATENT: CIENA CORPORATION FILES APPLICATION FOR "MANAGING CO-PACKAGING OF PHOTONIC INTEGRATED CIRCUITS"

GENEVA, April 8 -- CIENA CORPORATION (7035 Ridge RoadHanover, Maryland 21076) filed a patent application (PCT/US2024/045790) for "MANAGING CO-PACKAGING OF PHOTONIC INTEGRATED CIRCUITS" on Sep 09, 2024. With publication no. WO/2025/071897, the details related to the patent application was published on Apr 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BAUDOT, Charles (949 rue Jean-HamelinQuebec, Quebec G1V 3A2), BEAUPRE-LAFLAMME, Raphael (8745 Avenue de BeauvoirQuebec, Quebec G1G 5B1), PELLETIER, Francois (3997 Rue Louise-FisetQuebec, Quebec G1X 0B9), SAVARD, Simon (1015 Raoul-BlanchardQ...