INTERNATIONAL PATENT: CIENA CORPORATION FILES APPLICATION FOR "HYBRID CONDUCTOR-VAPOR CHAMBER HEAT SINK FOR HIGH POWER THIN ENVELOPE APPLICATIONS"

GENEVA, Sept. 2 -- CIENA CORPORATION (7035 Ridge RoadHanover, MD 21076) filed a patent application (PCT/US2025/016269) for "HYBRID CONDUCTOR-VAPOR CHAMBER HEAT SINK FOR HIGH POWER THIN ENVELOPE APPLICATIONS" on Feb 18, 2025. With publication no. WO/2025/178857, the details related to the patent application was published on Aug 28, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): AJERSCH, Peter (383 Terry Fox DriveOttawa, ON K2K 0L1), MEUNIER, Trevor (383 Terry Fox DriveOttawa, ON K2K 0L1)

Abstract: A hybrid conductor-vapor chamber heat sink including: an inner planar member disposed adjace...