INTERNATIONAL PATENT: CIENA CORPORATION FILES APPLICATION FOR "HIGH-ASPECT-RATIO VERTICAL INTERCONNECTS FOR HIGH-FREQUENCY APPLICATIONS"

GENEVA, June 19 -- CIENA CORPORATION (7035 Ridge RoadHanover, Maryland 21076-1426) filed a patent application (PCT/US2024/058580) for "HIGH-ASPECT-RATIO VERTICAL INTERCONNECTS FOR HIGH-FREQUENCY APPLICATIONS" on Dec 05, 2024. With publication no. WO/2025/122689, the details related to the patent application was published on Jun 12, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BOYER, Joel (2025 Delmar DriveOttawa, Ontario K1H 5P6), LUTKIEWICZ, Arkadiusz (85 College CircleOttawa, Ontario K1K 4R8), PELLERIN, Francois (3 Chesley St.Ottawa, Ontario K1S 3B9), BEAUPRE-LAFLAMME, Raphael (8745 Ave...