INTERNATIONAL PATENT: CHUNG, YON WOO, 정연우 FILES APPLICATION FOR "ASSEMBLY BOX USING SHOCK-ABSORBING PACKAGING MATERIAL AS BASE ASSEMBLY BLOCK"

GENEVA, Sept. 2 -- CHUNG, Yon Woo (6-1 Baramdeuri 23-gil,Songpa-gu,Seoul 05511), 정연우 (서울특별시송파구바람드리23길 6-1) filed a patent application (PCT/KR2025/099465) for "ASSEMBLY BOX USING SHOCK-ABSORBING PACKAGING MATERIAL AS BASE ASSEMBLY BLOCK" on Feb 19, 2025. With publication no. WO/2025/178463, the details related to the patent application was published on Aug 28, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHUNG, Yon Woo (6-1 Baramdeuri 23-gil,Songpa-gu,Seoul 05511), 정Ꮛ...