INTERNATIONAL PATENT: CHEN, CHIEN WEN, WU, CHUNTE RICHARD FILES APPLICATION FOR "INTEGRATED CIRCUIT PACKAGES AND PACKAGING SUBSTRATES AND METHODS FOR MANUFACTURING INTEGRATED CIRCUIT PACKAGES"

GENEVA, April 8 -- CHEN, Chien Wen (11F.-5, No. 118, Songjiang Rd., Zhongshan Dist.Taipei, 104), WU, Chunte Richard (6724 Bitterroot Place, CA 95120, USASan Jose, California 95120) filed a patent application (PCT/US2024/048290) for "INTEGRATED CIRCUIT PACKAGES AND PACKAGING SUBSTRATES AND METHODS FOR MANUFACTURING INTEGRATED CIRCUIT PACKAGES" on Sep 25, 2024. With publication no. WO/2025/072250, the details related to the patent application was published on Apr 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHEN, Chien Wen (11F.-5, No. 118, Songjiang Rd., Zhongshan Dist.Taipei, 104), WU...