INTERNATIONAL PATENT: CHAO, YANG, 晁阳 FILES APPLICATION FOR "3D PACKAGING INTERPOSER STRUCTURE AND FORMING METHOD THEREFOR AND PACKAGED DEVICE"

GENEVA, July 7 -- CHAO, Yang (Zhongguancun Building 923, Room 106Haidian District, Beijing 100086), 晁阳 (中国北京市海淀区中关村923号楼106号) filed a patent application (PCT/CN2024/137293) for "3D PACKAGING INTERPOSER STRUCTURE AND FORMING METHOD THEREFOR, AND PACKAGED DEVICE" on Dec 06, 2024. With publication no. WO/2025/139695, the details related to the patent application was published on Jul 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHAO, Yang (Zhongguancun Building 923, Room 106Haid...