GENEVA, March 9 -- CERACON GMBH (Talstr. 297990 Weikersheim) filed a patent application (PCT/EP2024/073480) for "METHOD AND DEVICE FOR SEALING AND/OR ADHESIVELY BONDING A SUBSTRATE" on Aug 21, 2024. With publication no. WO/2025/045697, the details related to the patent application was published on Mar 06, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KUKLA, Frank (Hubertusschlucht 1797082 Wurzburg), WEINER, Heiko (Silcherstr. 797990 Weikersheim), HAYN, Daniel (Unterer Laubberg 3097285 Rottingen)
Abstract:
The invention relates to a method for sealing and/or adhesively bonding a substrat...