INTERNATIONAL PATENT: CEMEDINE CO., LTD., セメダイン株式会社 FILES APPLICATION FOR "STRUCTURAL ADHESIVE APPLICATION THICKNESS ADJUSTMENT METHOD, APPLICATION THICKNESS ADJUSTMENT JOINT MEMBER AND APPLICATION THICKNESS ADJUSTMENT STRUCTURE"

GENEVA, July 8 -- CEMEDINE CO., LTD. (1-11-2, Osaki, Shinagawa-ku, Tokyo1418620), セメダイン株式会社 (東京都品川区大崎１丁目１１番２号) filed a patent application (PCT/JP2024/043959) for "STRUCTURAL ADHESIVE APPLICATION THICKNESS ADJUSTMENT METHOD, APPLICATION THICKNESS ADJUSTMENT JOINT MEMBER, AND APPLICATION THICKNESS ADJUSTMENT STRUCTURE" on Dec 12, 2024. With publication no. WO/2025/142508, the details related to the patent application was published on Jul 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed b...