GENEVA, April 15 -- CEMEDINE CO., LTD. (1-11-2, Osaki, Shinagawa-ku, Tokyo1418620), セメダイン株式会社 (東京都品川区大崎１丁目１１番２号) filed a patent application (PCT/JP2024/034691) for "ADHESIVE COMPOSITION" on Sep 27, 2024. With publication no. WO/2025/074954, the details related to the patent application was published on Apr 10, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KOTANI, Jun (c/o CEMEDINE CO., LTD., 1-11-2, Osaki, Shinagawa-k...