INTERNATIONAL PATENT: CELESTIAL AI INC. FILES APPLICATION FOR "PACKAGING OPTICAL COMPONENTS IN A CIRCUIT PACKAGE"

GENEVA, Dec. 17 -- CELESTIAL AI INC. (2962 Bunker Hill LaneSuite 200Santa Clara, Utah 95054) filed a patent application (PCT/US2025/031959) for "PACKAGING OPTICAL COMPONENTS IN A CIRCUIT PACKAGE" on Jun 02, 2025. With publication no. WO/2025/255041, the details related to the patent application was published on Dec 11, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): AGGARWAL, Ankur (c/o Celestial AI Inc.2962 Bunker Hill LaneSuite 200Santa Clara, California 95054), RATHI, Anmol (c/o Celestial AI Inc.2962 Bunker Hill LaneSuite 200Santa Clara, California 95054), POTHUKUCHI, Suresh Venkata (c/o ...