INTERNATIONAL PATENT: CELESTIAL AI INC. FILES APPLICATION FOR "CO-PACKAGED OPTICS WITH OPTICALLY TRANSPARENT MOLDING COMPOUND"

GENEVA, Jan. 27 -- CELESTIAL AI INC. (2962 Bunker Hill Ln, Suite 200Santa Clara, California 95054) filed a patent application (PCT/US2025/037833) for "CO-PACKAGED OPTICS WITH OPTICALLY TRANSPARENT MOLDING COMPOUND" on Jul 16, 2025. With publication no. WO/2026/019872, the details related to the patent application was published on Jan 22, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): AGGARWAL, Ankur (2962 Bunker Hill Ln, Suite 200Santa Clara, California 95054), SAHNI, Subal (2962 Bunker Hill Ln, Suite 200Santa Clara, California 95054), STAFFARONI, Matteo (2962 Bunker Hill Ln, Suite 200Santa...