INTERNATIONAL PATENT: CARL ZEISS SMT GMBH FILES APPLICATION FOR "HEAT DISSIPATION DEVICE FOR SEMICONDUCTOR TECHNOLOGY AND PROJECTION EXPOSURE SYSTEM COMPRISING THE HEAT DISSIPATION ASSEMBLY"

GENEVA, Dec. 8 -- CARL ZEISS SMT GMBH (Rudolf-Eber-StraBe 273447 Oberkochen) filed a patent application (PCT/EP2025/063559) for "HEAT DISSIPATION DEVICE FOR SEMICONDUCTOR TECHNOLOGY AND PROJECTION EXPOSURE SYSTEM COMPRISING THE HEAT DISSIPATION ASSEMBLY" on May 16, 2025. With publication no. WO/2025/247668, the details related to the patent application was published on Dec 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HARTJES, Joachim (Rudolf-Eber-StraBe 273447 Oberkochen)

Abstract: The invention relates to a heat dissipation device for use in a semiconductor technology system, compri...